Welcome Message

Sayoon Kang
General Chair
It is our great pleasure to announce that the 20th International Symposium on Microelectronics and Packaging (ISMP 2022) will be held at Busan, Korea, on November 9th (Wed.) ~ 11th (Fri.), 2022. The ISMP 2022, organized by KMEPS (the Korean Microelectronics and Packaging Society), presents a valuable chance to share the latest electronic packaging technologies with other professionals as well as to boost communication and collaboration with colleagues around the world. The ISMP 2022 organizing committee promises to provide an outstanding and fruitful program, which will be a great opportunity that you do not miss. We cordially invite you to submit abstracts for oral and poster presentation. We look forward to meeting you at ISMP 2022 in Busan, Korea on November 9th (Wed.) ~ 11th (Fri.), 2022.