Overview

ISMP 2022 is the 20th International Symposium on Microelectronics and Packaging. ISMP is the top-tier international event that brings together the expertise in electronics packaging and microelectronic systems from academia to industry. This year, the conference is held to provide a bigger chance to exchange ideas and experiences from November 9(Wed.)~11(Fri.), 2022 at Hanwha Resorts, Busan, Korea.
As the conference site, Busan is the second-largest city in Korea and famous for tourist and shopping attractions as well as its astounding variety of fresh seafood. You will not forget the vibrant marketplace experience and the exceptional hospitality of Busan.
We look forward to seeing you in Busan at the ISMP 2022.

Title The 20th International Symposium on Microelectronics and Packaging
Event Type Onsite face-to-face Symposium
Date November 9(Wed.)~11(Fri.), 2022
Venue Hanwha Resorts, Busan, Korea
Host Korea Microelectronics and Package Society
Program Welcome Reception, Plenary/ Keynote/ Invited/ Oral/ Poster Presentation and Banquet
Website http://ismp2022.org/
Offcial Language English
Key Dates
Abstract submission July 29, 2022
Acceptance notification September 2, 2022
Pre-registration Deadline November 2, 2022
Manuscript submission December 31, 2022
Secretariat KMEPS (Korea Microelectronics and Packaging Society)
Rm. 815, Korea Science and Technology Bldg., 22, Teheran-ro 7-gil, Gangnam-gu, Seoul 06130, Republic of Korea
Tel.: +82-2-538-0962
E-mail : kmeps@ismp2022.org