Plenary Speakers

Sir. MJ (Myung-June) Lee
Intel Corporation, USA
“Advanced Packaging Technologies and Roadmap”

Chip to Package Interconnection Technologies is keeping its track of evolution path and enabling industry roadmapping beyond Moore’s Law. Continuous innovation developing Semiconductor IC’s and Interconnection core technologies are accelerating the momentum toward quantum leaps in technology, while the industry faces and discovers new challenges when combining multiple heterogeneous core technologies for 2.5/3D/Chiplet architecture.
This talk will review advanced CPI technologies, address pros and cons of emerging CPI technologies in fields and discuss steps to plan a practical approach over the newly discovered challenges aiming to High Volume Manufacturable Roadmap in the future.

MJ (Myung-June) Lee is a Sr. Technical Director leading Package Technology of Network Switch Group in the Data Center (NEX) of Intel Corp. San Jose, CA with responsibilities for advanced packaging technology development and productization. He has over 30 years’ experience in the IC Packaging/Assembly industry and has spent most of that time in new/advanced packaging technology process and material development. Prior to joining Intel, MJ was at Oracle, Altera, Xilinx, National Semiconductor Corp., and Amkor Technology Korea. MJ holds a BS degree in Chemistry.

Dr. Amram Eitan
Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC), Taiwan
“Bonding Technologies – Enabling Advanced Packaging”

Advanced packaging is introducing exciting opportunities to product designers, to drive forward overall product performance in all application segments. Different die types are integrated in optimized manner, with various geometrical configurations (Examples- INFO, CoWoS). Furthermore, die and substrate warpage, die sizes, pitch scaling, are some of key technical challenges that need to be addressed. To bring these advanced packaging opportunities to reality, and enable high design flexibility, special attention needs to be drawn to the die bonding technology to be applied. This talk will be focused on the approaches for well-controlled die bonding, to address the advanced packaging challenges. Thermocompression bonding, with its unique features and control knobs, will be of main focus of the talk, in addition to other emerging bonding technologies.

Received his B.Sc. in Chemical Engineering from Ben-Gurion University in Israel, M.Sc. in Chemistry from the Weizmann Institute in Israel, and his Ph.D. in Materials Science and Engineering from Rensselaer Polytechnic Institute (RPI) in Troy, NY, USA. Has been working as an area manager at Intel in the Assembly and Test Development Department, developing assembly materials, processes, and managed the development and implementation of Thermocompression Bonding (TCB) at Intel from equipment development, through process development and implementation in Intel’s factories. Currently a director at TSMC, in the Advanced Packaging Technology and Services (APTS), leading the bonding technology development towards Advanced Packaging.