Full Paper Submission

Full Paper

Full Paper must be written clearly in English, and submitted prior to December 31, 2022. Authors may further edit and modify submitted abstracts until the submission deadline.
Acknowledgment of your submission will be sent to the e-mail address provided by the main author. Please make sure that you receive an e-mail confirmation after making your submission. If you do not receive this e-mail confirmation, it means we have not received your Paper.

Notification of Acceptance

All submitted paper will be reviewed by the Program Committee according to standard review procedures. Notification of acceptance will be sent via e-mail by February 28, 2023.

Journal Publishing

After peer review, accepted manuscripts will be published in one of the following Journals. (It will be updated whenever journals are added.)

1) MDPI Coatings (ISSN 2079-6412: IF=2.881)
Submit your paper before November 20, 2022 via website
(https://www.mdpi.com/journal/coatings/special_issues/interface_II)
Coatings Template
2) Microelectronics Reliability (Coming Soon!)
3) Microelectronics International (Special Issue: Heterogeneous Integration and chiplets Interconnection)
Submit your paper via website (https://mc.manuscriptcentral.com/miij).
4) KMEPS (Journal of the Microelectronics and Packaging Society)
Submit your paper before December 9, 2022 via e-mail (kmeps@kmeps.or.kr).

※ After the evaluations process, publication fee will be billed. If publication fee is not paid within a set period, the manuscript will not be published.