It is our great pleasure to announce that the 20th International Symposium on Microelectronics and Packaging (ISMP cor2022) will be held at Hanwha Resorts, Busan, Korea, on November 9(Wed.)~11(Fri.), 2022. The ISMP 2022, organized by KMEPS (The Korean Microelectronics and Packaging Society), presents a valuable chance to share the latest electronic packaging technologies with other professionals as well as to boost communication and collaboration with colleagues around the world.
The ISMP 2022 organizing committee promises to provide an outstanding and fruitful program, which will be a great opportunity that you do not miss. We cordially invites you to submit abstracts for oral and poster presentation. We look forward to meeting you at ISMP 2022 in November.

Plenary Speakers
Sir. MJ (Myung-June) Lee
Intel Corporation, USA
“Advanced Packaging Technologies and Roadmap” Biography

Dr. Amram Eitan
Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC), Taiwan
“Bonding Technologies – Enabling Advanced Packaging” Biography
Keynote Speakers
Dr. Un-Byoung Kang, Master
Samsung Electronics Co., Ltd., Korea
“Advanced Packaging Solution for Heterogeneous Integration – Status and Challenges” Biography

Dr. Jiho Kang, Fellow
SK Hynix Inc., Korea
“An Overview of the Past, Present and Future of 3D Device Technology” Biography

Sir. Jim Cao, Senior VP
Universal Scientific Industrial Co., Ltd. (USI) *ASE Group, China
“SiP, The Next Revolution for Microelectronics Packaging and The Challenges” Biography

Prof. Sung Kyu Lim
Georgia Institute of Technology, Program Manager/ DARPA, USA
“Glass Interposer Integration of Logic and Memory Chiplets: PPA and Reliability Benefits” Biography

Young Engineers Forum
Prof. Bongtae Han
University of Maryland, USA

“Part I: History of Packaging Technologies and Perspective”
“Part II: Engineering Chronic Problem – Why difficult to find its root causes?”

Invited Speakers
[Novel Package Substrate]
  • 1. Sir. Eita Horiki
    Sekisui Korea Co., Ltd., Korea
    “Build-up Dielectric Material that enables High Temp. Low Loss, High Toughness, High Yield Advanced FC-BGA Substrates”
  • 2. Sir. Kosuke Tsukamoto
    Shinko Electric Industries Co., Ltd., Japan
    “Demonstration of 2.3D Organic Package with Increased Interposer Size and Layer Count”
  • 3. Sir. Hidetoshi Seki
    Sumitomo Bakelite Co., Ltd., Japan
    “Next-Generation Packaging Solutions for High-speed Communications”
  • 4. Dr. Minyoung Lim
    LG Chem Ltd., Korea
    “Novel Low Temperature Curable Photoimageable Dielectric Materials for Advanced Packaging”
  • 5. Sir. Yoshinori Matsuura
    Mitsui Mining & Smelting Co., Ltd., Japan
    “Introduction of the Rigid Carrier Substrates with Releasing Function for 2.5D Organic Interposer Packaging Solutions”
[2.5D and 3D Interconnect]
  • 6. Prof. Sanghwa Yoon
    Hanyang University, Korea
    “CMP-less Metal Planarization for 3D Interconnection”
  • 7. Prof. Hyo-Jong Lee
    Dong-A University, Korea
    “Calculation of Copper Filling and Microstructural Analysis in TSV and PCB Patterns”
  • 8. Prof. Myung Jun Kim
    Kyung Hee University, Korea
    “Additives in Cu Electrodeposition for TSV Filling”
  • 9. Sir. Yong-Tae Kwon
    Nepes Corp., Korea
    “Die-stackable 3D Package Using Fan-out Technology”
  • 10. Dr. Seung-jae Yun
    BSP Inc., Korea
    “A Novel Technology for Crackless Through-Glass Via”
  • 11. Dr. YilHak Lee
    DuPont Electronics and Industrial, Korea
    “Advanced Packaging Materials Solution for 3D Heterogenous Integration”
  • 12. Sir. Lewis(In-Soo) Kang
    Nepes Corp., Korea
    “Fanout Technology Based Antenna-in-package (FO-AiP) for 5G mmWave Application”
  • 13. Prof. Eun-Ho Lee
    Sungkyunkwan University, Korea
    “Deep Learning Algorithm to Predict Anisotropic Thermal Conductivity of Three-dimensionally Connected Semiconductor Package Layers”
[Package Materials and Process]
  • 14. Sir. Mitsuo Sugino
    Senju Metal Industry Co., Ltd., Japan
  • 15. Sir. Hatakeyama Keiichi
    Showa Denko Materials Co., Ltd., Japan
    “Total Solution Activity of Showa Denko Materials for Future Advanced Semiconductor Packages”
[Automotive and Power Electronics]
  • 16. Dr. Dongjin Kim
    Korea Institute of Industrial Technology (KITECH), Korea
    “Heat-resistant Packaging Technologies of Wide Band-gap Power Modules”
  • 17. Dr. Hanbyul Kang
    Korea Automotive Technology Institute (KATECH), Korea
    “Reliability Challenges of Micro-electronics Packaging for Eco-friendly Car”
  • 18. Dr. Semin Park
    Hyundai Mobis Co., Ltd., Korea
    “Power Semiconductor Module for Electrified Vehicles”
  • 19. Dr. Zheng Zhang
    Osaka University, Japan
    “On-line Monitoring of the Health State of Power Assembly During Power Cycling by Using Acoustic Emission Technology”
  • 20. Dr. Youngseok Kim
    Hyundai Motor Company, Korea
    “Design of Double Side Cooling Power Module Structure to Reduce Thermal Stress for Next Generation PE System”
  • 21. Sir. Kuah Teng Hock, Eric
    ASM Pacific Technology (ASMPT), Singapore
    “Characterization of High Power Electronics Produced by ASMPT Pressure Sintering Solution for Automotive”
[Emerging Technologies]
  • 22. Dr. Kwang-Seong Choi
    Electronics and Telecommunications Research Institute (ETRI), Korea
    “Non-Fungible SITRAB (Simultaneous Transfer and Bonding) Technology for Commercialization of micro LED Displays”
  • 23. Prof. Keon Jae Lee
    Korea Advanced Institute of Science and Technology (KAIST), Korea
    “Flexible Piezoelectric-sensor and MicroLED”
  • 24. Dr. Heeyeoun Kim
    National NanoFab Center (NNFC), Korea
    “Future of Wafer-level Packaging for Sensors : From Micro to Quantum”
  • 25. Sir. Seog Soon Kim, CEO
    Unijet Co., Ltd., Korea
    “Introduction of the Inkjet Printing Technology for Semiconductor Packaging”
  • 26. Dr. Won-Seok Chang
    Korea Institute of Machinery & Materials (KIMM), Korea
    “Development of Nanoimprinting and Maskless Lithography System and Process with Improved Patterning Quality for Advanced Packaging”
[Flexible and Printed Electronics]
  • 27. Prof. Yoonseok Park
    Kyung Hee University, Korea
    “Wireless, Skin-interfaced Pressure Sensors for Biomedical Application”
  • 28. Prof. Tae-il Kim
    Sungkyunkwan University, Korea
    “Unconventional Band Pass Filters for Bioelectronics”
  • 29. Prof. Wenlong Cheng
    Monash University, Australia
    “Gold Electronic Skins and Tattoos for Connected Healthcare”
  • 31. Sir. Masayoshi Otomo
    NAMICS Corporation, Japan
    “Low Temperature Sintering Nano Silver Paste for Flexible Applications”
  • 32. Prof. Suckwon Hong
    Pusan National University, Korea
    “Tissue-interfaced Microelectronic Devices for Therapeutic Modulation”
  • 33. Prof. Sung Hun Jin
    Incheon National University, Korea
    “Physically Detachable and Operationally Stable Inorganic Perovskite Photodetector Arrays for Broadband Flexible Optical Systems”
  • 34. Prof. Yei-Hwan Jung
    Hanyang University, Korea
    “Strain-unaffected Stretchable Wireless Electronics”
  • 35. Prof. Ki Jun Yu
    Yonsei University, Korea
    “Unconventional Bio-integrated Electronics towards Human Machine Interface (HMI) Applications”
[Hybrid Bonding]
  • 36. Sir. Yong Chang Bum (Andy)
    Applied Materials Inc.(AMAT), Singapore
    “C2W Stacked Die Bonding for Memory and Logic”
  • 37. Sir. Ip Chun Hung, Samuel
    ASM Pacific Technology (ASMPT), Hong Kong
    “Interconnect Solutions for Heterogeneous Intergradation”
  • 38. Prof. Kyung Min Kim
    Korea Advanced Institute of Science and Technology (KAIST), Korea
    “Comprehensive Study on the Next-generation Chip-package Interface: Materials, Design, and Reliability”
  • 39. Prof. Sungdong Kim
    Seoul National University of Science and Technology (SEOULTECH), Korea
    “Low Temperature Hybrid Bonding Technology for Heterogeneous Packaging”
  • 40. Prof. Tadatomo Suga
    Meisei University, Japan
    “The Surface Activated Bonding for 3D Heterogeneous Integration”
  • 41. Dr. Thomas Glinsner
    EV Group (EVG), Austria
    “W2W Hybrid Bonding System for Next Generation Integration Scheme”
[Test and Reliability]
  • 42. Dr. Ralf Langhans
    sentronics metrology GmbH, Germany
    “Novel Wafer Metrology Center for Microelectronic Packaging Applications”
Symposium Topics

ISMP 2022 will include all basic/applied sciences and technologies in the fields of electronic materials, devices, and packaging. Topics may include, but are not limited to, the following areas:

  • Novel Packaging Technologies for AI, IoT, and Big data
  • Packaging Solutions for 5G/6G Applications
  • System Integration with Advanced Packaging Technologies
  • Electronic Materials for Interconnects and Packaging
  • Emerging Process for Interconnects and Packaging
  • PCB, Solder, and Assembly Process
  • Automotive & Power Electronic Packaging
  • Sensors, LED, and Emerging Packaging Technology
  • Flexible, Wearable, and Printed Electronics
  • MEMS/NEMS Packaging and Applications
  • Reliability of Electronic Devices and Systems
  • Design Tools and Modeling
  • 3D Interconnect
  • Hybrid Bonding
What’s New
Title Date